What's Happening?
memsstar Ltd., a provider of etch and deposition equipment, has launched a new vacuum vapour-phase metal-assisted chemical etching (MacEtch) technology. Developed in collaboration with the Paul Scherrer
Institute and Fraunhofer ENAS, this technology represents a significant advancement in silicon etching for micro- and nanoscale architectures. The vapour-phase MacEtch method offers reduced porosity, improved uniformity, and suitability for high aspect ratio nanostructures. Implemented on memsstar's ORBIS platform, the technology allows precise control over etching parameters, supporting up to 8-inch wafers and enabling uniform etch profiles across large substrates.
Why It's Important?
The introduction of vapour-phase MacEtch technology by memsstar Ltd. marks a breakthrough in the semiconductor and MEMS industries. This technology provides enhanced control and reproducibility in silicon etching, which is crucial for developing advanced micro- and nanostructures. By offering improved anisotropy and uniformity, memsstar's technology can unlock new design possibilities for applications in MEMS, microfluidics, photovoltaics, and more. This advancement could drive innovation in these fields, potentially leading to more efficient and sophisticated devices.
What's Next?
memsstar Ltd. plans to focus on exploring fundamental MacEtch parameters to enhance scalability and compatibility across various device geometries. The company aims to expand its market reach by targeting sectors such as MEMS, microfluidics, and advanced semiconductor packaging. As memsstar continues to refine its technology, it may collaborate with industry partners to integrate its solutions into existing manufacturing processes. The success of this technology could lead to increased adoption and further advancements in semiconductor and MEMS device fabrication.
