SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility
Reuters

SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility

By Kenrick Cai and Heekyong Yang WEST LAFAYETTE, Indiana, Aug 27 (Reuters) - South Korean chipmaker SK Hynix on Thursday held a groundbreaking ceremony for an advanced packaging and research facility in Indiana worth more than $4 billion, expanding its U.S. footprint to meet growing demand for memor
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