Taiwan breaks ground on advanced packaging park anchored by TSMC
Reuters

Taiwan breaks ground on advanced packaging park anchored by TSMC

By Wen-Yee Lee TAIPEI, Sept 21 (Reuters) - Taiwan broke ground on a new advanced packaging industrial park in the southern city of Kaohsiung on Monday, where TSMC plans to establish facilities for technology validation and talent training. TSMC, the world's largest contract chipmaker, will build two
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