The twin alliances are aimed at bolstering both technology capabilities and supply-chain resilience for Kaynes Semicon’s upcoming operations, at a time when India is pushing to establish itself as a credible player in the global semiconductor value chain.
Under the agreement with AOI Electronics, Kaynes Semicon will gain access to advanced back-end semiconductor technologies, including advanced packaging, panel-level packaging and wafer-level redistribution layer (RDL) processes.
AOI Electronics is known for its expertise in semiconductor back-end manufacturing, an area that has become increasingly critical as demand rises from sectors such as automotive electronics, industrial applications, consumer devices and communications equipment.
The collaboration is expected to help Kaynes Semicon offer end-to-end back-end semiconductor solutions from India, positioning the company to serve both domestic and global customers.
Separately, Kaynes Semicon has tied up with Mitsui & Co., one of Japan’s largest trading and investment conglomerates, to secure access to key raw materials required for semiconductor manufacturing. These include lead frames, moulding compounds, die-attach materials, specialty gases and semiconductor-grade chemicals.
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The partnership with Mitsui is aimed at reducing vulnerabilities linked to global supply-chain disruptions and ensuring steady availability of critical inputs as Kaynes Semicon ramps up its manufacturing footprint.
Management said the agreements are intended to support operational readiness and scale-up, while also aligning with the government’s broader push under the ‘Make in India’ and ‘Atmanirbhar Bharat’ initiatives to localise high-value semiconductor manufacturing.
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