What's Happening?
Boise State University’s College of Engineering has received a $7.4 million grant from the National Science Foundation to establish the AWESOME Center, aimed at enhancing semiconductor education and research. This initiative seeks to bolster Idaho's position in the U.S. semiconductor supply chain and prepare students for high-demand jobs in the industry. The center will provide students with access to mentorship and advanced technology used by industry leaders like Micron, Intel, and TSMC. Faculty members emphasize the importance of this funding in preparing students for the workforce and advancing semiconductor research, particularly in developing more efficient and environmentally friendly technologies.
Why It's Important?
The grant is significant as it addresses the growing demand for skilled workers in the semiconductor industry, which is crucial for technological advancement and economic growth. By training students in cutting-edge semiconductor processes, Boise State University is helping to fill the workforce gaps in Idaho's semiconductor sector. This initiative not only supports local industry needs but also positions Idaho as a key player in the national semiconductor supply chain. The focus on environmentally friendly technologies aligns with broader industry trends towards sustainability, potentially influencing future semiconductor manufacturing practices.
What's Next?
The establishment of the AWESOME Center is expected to attract more research talent to Idaho and provide students with valuable industry exposure. As Micron plans to create 17,000 new semiconductor jobs, the center will play a critical role in supplying qualified candidates. The program aims to retain homegrown talent, reducing the need for companies to recruit outside the state. Additionally, the research into using light instead of electricity for computing could lead to significant energy savings and increased processing capabilities, impacting the future of artificial intelligence and other high-energy applications.
