Amid surge in AI memory demand, SK Hynix to invest $13 billion in new chip packaging facility

SUMMARY

AI Generated Content
  • SK Hynix invests $12.9B in advanced chip packaging amid AI-driven memory chip shortage.
  • Construction starts April, targeting 2027 completion to meet HBM demand forecasts.
  • SK Hynix aims to maintain AI memory lead, supporting South Korea's chip ecosystem.
AD
AD